清华大学电子工程系研究生导师介绍：刘勇攀

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刘勇攀   博士 讲师

中国北京市清华大学电子工程系 100084

电话： +86-10-62796637

传真：+86-10-62770317

电子邮箱： ypliu@tsinghua.edu.cn

学术成果

[1] B.H. Ying, Y.P. Liu, H. Z. Yang, H. Wang, “Evaluation of Tunable Data Compression in Energy-Aware Wireless Sensor Networks”, Sensors, 2010, 10, 3195-3217 (SCI IF 1.870)

[2] Tian Z X, Liu Y P, Yang H Z. “Combined novel gate level model and critical primary input sharing for genetic algorithm based maximum power supply noise estimation.” Chinese Journal of Semiconductors, 2007, 28(9): 1375-1380

[3] Shaohua Wang, Guangming Yu, Yongpan Liu , Huazhong Yang, “Low noise fully digitally controlled LC oscillator with back-to-back in series MOS varactors”, Journal of Tsinghua University (Science and Technology), 48(7) 2008.

[4] Yongpan Liu, Huazhong Yang, Rong Luo, Hui Wang, “Thermal-Aware Floorplanning Considering Empty Space Effect Based on Genetic Algorithms”, Chinese Journal of Electronics, vol.16 no.3 429-434, July, 2007

[5] Yongpan Liu, Yinan Sun, Yihao Zhu, Huazhong Yang, "Design Methodology of Variable Latency Adders with Multistage Function Speculation", To appear in ISQED2010, San Jose, 2010

[6] Hengyu Long, Yongpan Liu, Yiqun Wang, Robert P. Dick, Huazhong Yang, "Battery Allocation for Wireless Sensor Network Lifetime Maximization Under Cost Constraints", p.705-712, ICCAD 2009

[7] Jue Wang, Beihua Ying, Yongpan Liu, Huazhong Yang, Hui Wang, “Energy Efficient Architecture of Sensor Network Node Based on Compression Accelerator”, p.117--120, Boston, GLSVLSI, 2009.

[8] Hengyu Long, Yongpan Liu, Robert P. Dick, Huazhong Yang, “Energy-Efficient Spatially-Adaptive Clustering and Routing in Wireless Wireless Sensor Networks”, p.1267-1272, Nice, DATE, 2009.

[9] Yongpan Liu, Robert Dick, Li Shang, Huazhong Yang, “Accurate Temperature-Dependent Integrated Circuit Leakage Power Estimation is Easy”, p.1526-1532 , DATE 2007, Nice, France. (Cited 19 times)

[10] Yongpan Liu, Huazhong Yang, Robert Dick, Hui Wang, Li Shang, “Thermal vs Energy Optimization for DVFS-enabled Processors in Embedded Systems”, p. 204- 209 , ISQED 2007, San Jose, USA. (Cited 22 times)